Wafer bonding

Results: 51



#Item
31SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact

SEMI-FINISHED BONDED SUBSTRATES: SILICON ON GLASS (SOG) µm up. The precise specifications of each Contact

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Source URL: www.enas.fraunhofer.de

Language: English - Date: 2015-01-15 06:53:22
32THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact

THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact

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Source URL: www.enas.fraunhofer.de

Language: English - Date: 2015-01-15 06:04:42
33SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm

SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm

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Source URL: www.enas.fraunhofer.de

Language: English - Date: 2015-01-15 05:44:20
34F R A U N H O F E R I n s t i t u t e F o R E l e c t roni c N A no s y s t e m s E N A S  System Packaging

F R A U N H O F E R I n s t i t u t e F o R E l e c t roni c N A no s y s t e m s E N A S System Packaging

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Source URL: www.enas.fraunhofer.de

Language: English - Date: 2015-01-15 04:48:28
35FRAUNHOFER CAM IS A COMPETENCE CENTER FOR MICROSTRUCTURE DIAGNOSTICS A N D M AT E R I A L C H A R A C T E R I Z AT I O N WITHIN FRAUNHOFER IWM IN HALLE FRAUNHOFER CENTER

FRAUNHOFER CAM IS A COMPETENCE CENTER FOR MICROSTRUCTURE DIAGNOSTICS A N D M AT E R I A L C H A R A C T E R I Z AT I O N WITHIN FRAUNHOFER IWM IN HALLE FRAUNHOFER CENTER

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Source URL: www.iwm.fraunhofer.de

Language: English - Date: 2014-05-19 10:55:49
36F R A U N H O F E R I N S T I T U T E F O R M E C H A N I C S O F M AT E R I A L S I W M  COMPONENTS IN MICROELECTRONICS AND MICROSYSTEMS TECHNOLOGY  Your competent partner for

F R A U N H O F E R I N S T I T U T E F O R M E C H A N I C S O F M AT E R I A L S I W M COMPONENTS IN MICROELECTRONICS AND MICROSYSTEMS TECHNOLOGY Your competent partner for

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Source URL: www.en.iwm.fraunhofer.de

Language: English - Date: 2011-11-18 03:55:18
37Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1  2 i nv es ts 16 M i l l i on

Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1 2 i nv es ts 16 M i l l i on

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Source URL: www.ims.fraunhofer.de

Language: English - Date: 2014-02-15 05:05:43
386- Bonding LetiDay_ChDeguetfinal

6- Bonding LetiDay_ChDeguetfinal

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Source URL: www-leti.cea.fr

Language: English - Date: 2014-07-18 03:18:39
39C o n tact  V i s it u s at t h e I n n o T r a n s i n B e r li n : Hall 2 3 b , B o o t h 2 0 6

C o n tact V i s it u s at t h e I n n o T r a n s i n B e r li n : Hall 2 3 b , B o o t h 2 0 6

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Source URL: www.verkehr.fraunhofer.de

Language: English - Date: 2014-12-05 21:11:14
40MEMS & Micro Power Generation (MPG) DARPA Tech 2000 William C. Tang, Ph. D. Program Manager[removed]

MEMS & Micro Power Generation (MPG) DARPA Tech 2000 William C. Tang, Ph. D. Program Manager[removed]

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Source URL: archive.darpa.mil

Language: English - Date: 2000-10-06 09:20:49